BMBP33R5/3R4-6PA

Film ceramic filter refers to the ceramic substrate by sputtering, lithography, electroplating and other semiconductor technology, resistors, inductors, capacitors, metal conduction band integration into one, the formation of the filter. Mainly has the following characteristics: high integration, small size, high line accuracy, excellent component performance, high consistency, temperature stability and good frequency characteristics.

Mainly used in the field of communications: microwave millimeter wave circuit, microwave navigation guidance, satellite communications, radio communications, radar systems, sensing technology, test and measurement, instrumentation.

Filters, as a frequency selective device, play an important role in RF / microwave applications. Traditional filters are bulky, expensive to manufacture, and not expensive Easy integration with monolithic integrated circuits. At present, we apply the unique technology of the thin film ceramic to the design and manufacture of the filter and obtain the high performance and small volume of the thin film ceramic filter chip.

Precautions
1. The chip is recommended sub-cavity use, both sides of the side wall from about 0.2mm, surface distance Cover about 3mm, the chip ports are interchangeable;
2. Chip recommended low-stress conductive adhesive (such as ME8456) bonding;
3. Chip should be installed in Kovar (recommended) or molybdenum copper with ceramic thermal expansion coefficient(6.7ppm /℃) on the carrier, the carrier thickness≥0.2mm;
4 circuit board micro-chip wire bonding connection, it is recommended microstrip bonding at mining

Features
high-precision film processing technology
high performance, low temperature drift, high power
Ceramic substrate, 50Ω coplanar waveguide output
Gold wire bonding, suitable for multi-chip integrated module applications